Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943857 | Substrate with multi-layer resin structure and semiconductor device including the substrate | Kentaro Kaneko, Tsukasa Nakanishi, Junichi Nakamura, Koji Watanabe | 2021-03-09 |