IY

Isao Yokokawa

SC Shin-Etsu Handotai Co.: 1 patents #5 of 28Top 20%
Overall (2021): #423,086 of 548,734Top 80%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10886163 Method for manufacturing bonded wafer — 2021-01-05