Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069560 | Method of transferring device layer to transfer substrate and highly thermal conductive substrate | Yoshihiro Kubota | 2021-07-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069560 | Method of transferring device layer to transfer substrate and highly thermal conductive substrate | Yoshihiro Kubota | 2021-07-20 |