Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11059973 | Heat-curable resin composition and semiconductor device | Yoshihiro TSUTSUMI, Norifumi Kawamura, Yoshihira Hamamoto, Yuki Kudo | 2021-07-13 |
| 11046848 | Heat-curable resin composition for semiconductor encapsulation and semiconductor device | Yoshihiro TSUTSUMI, Yuki Kudo, Norifumi Kawamura, Yoshihira Hamamoto | 2021-06-29 |