Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11104976 | Bi-continuous composite of refractory alloy and copper and method for manufacturing the same | Il Hwan Kim, Hyun-Seok Oh, Sang Jun Kim, Eun Soo Park | 2021-08-31 |
| 10941463 | High-entropy alloy foam and manufacturing method for the foam | Eun Soo Park, Khurram Yaqoob, Je In Lee, Jin Yeon Kim | 2021-03-09 |