Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10905002 | Method for forming flexible substrate including via, and flexible substrate having via | Yongtaek Hong, Junghwan Byun, Byeongmoon Lee | 2021-01-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10905002 | Method for forming flexible substrate including via, and flexible substrate having via | Yongtaek Hong, Junghwan Byun, Byeongmoon Lee | 2021-01-26 |