Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978421 | Wafer-level packaging method and package structure | Hailong LUO | 2021-04-13 |
| 10910274 | Backside processed semiconductor device | Herb He Huang, Haiting Li, Jiguang Zhu | 2021-02-02 |
| 10910286 | Wafer-level system-in-package packaging method and package structure thereof | Hailong LUO | 2021-02-02 |