Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139552 | Method of forming a semiconductor device | Gareth Pryce Weale | 2021-10-05 |
| 11049792 | Package structure for semiconductor devices | Gareth Pryce Weale, Yik Yee Tan | 2021-06-29 |