EK

Eiji KUROSE

ON onsemi: 2 patents #51 of 370Top 15%
Overall (2021): #164,784 of 548,734Top 35%
2
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11018030 Fan-out wafer level chip-scale packages and methods of manufacture — 2021-05-25
10943886 Methods of forming semiconductor packages with back side metal — 2021-03-09