Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971434 | Lead frame package having conductive surface with integral lead finger | Ren Huei Tzeng | 2021-04-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971434 | Lead frame package having conductive surface with integral lead finger | Ren Huei Tzeng | 2021-04-06 |