Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10961411 | Inkjet adhesive, manufacturing method for semiconductor device, and electronic component | Mitsuru Tanikawa, Takashi Watanabe, Yusuke Fujita, Tasuku Yamada | 2021-03-30 |