Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189312 | Adhesive layer for bonding noble metal structure with a dielectric layer | — | 2021-11-30 |
| 11142820 | High refractive index hydrogenated silicon carbide and process | Deming Zhang, Minna Hovinen, Ziyou Zhou | 2021-10-12 |
| 11127423 | Devices including at least one adhesion layer and methods of forming adhesion layers | Michael C. Kautzky | 2021-09-21 |