Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11037593 | Methods of separating one or more substrates that are adhesively bonded to a carrier, and related systems and apparatuses | Ruhai Tian, Peter Gunderson | 2021-06-15 | $33,301,000 |