Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11074943 | Methods and devices for alleviating thermal boil off in immersion-cooled electronic devices | John W. Dykes | 2021-07-27 |
| 11069383 | Thermal interface materials for immersion cooled data storage devices | John W. Dykes | 2021-07-20 |