Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957705 | Three-dimensional memory devices having a multi-stack bonded structure using a logic die and multiple three-dimensional memory dies and method of making the same | Shigehisa Inoue, Yuki KASAI, Hironori Matsuoka | 2021-03-23 |