Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127655 | Memory die containing through-memory-level via structure and methods for making the same | Takumi Moriyama, Hiroshi Sasaki, Satoshi Shimizu | 2021-09-21 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127655 | Memory die containing through-memory-level via structure and methods for making the same | Takumi Moriyama, Hiroshi Sasaki, Satoshi Shimizu | 2021-09-21 |