Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177241 | Semiconductor device with top die positioned to reduce die cracking | Junrong Yan, Jianming Zhang, Min Zhao, Kailei Zhang, Chee Keong Chin | 2021-11-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177241 | Semiconductor device with top die positioned to reduce die cracking | Junrong Yan, Jianming Zhang, Min Zhao, Kailei Zhang, Chee Keong Chin | 2021-11-16 |