Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10942215 | Integrated circuit authentication from a die material measurement | Ryan Helinski, Jason Hamlet | 2021-03-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10942215 | Integrated circuit authentication from a die material measurement | Ryan Helinski, Jason Hamlet | 2021-03-09 |