Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205631 | Semiconductor package including multiple semiconductor chips | Yonghoon Kim, Jaehyun LIM, Sayoon Kang | 2021-12-21 |
YL
Yuntae Lee
Overall (2021): #194,516 of 548,734Top 40%
1
Patents 2021