Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10952329 | Copper clad laminates and method for manufacturing a printed circuit board using the same | Sang Jae Lee | 2021-03-16 |
YH
Youn Gyu Han
Overall (2021): #200,520 of 548,734Top 40%
1
Patents 2021