Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088089 | Package substrate | Sang Hoon Kim, Young Kuk Ko, Yong Soon Jang | 2021-08-10 |
| 10991647 | Printed circuit board and package structure having the same | Sang Hoon Kim, Hea Sung Kim, Gyu Mook Kim, Young Kuk Ko | 2021-04-27 |