Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101243 | Semiconductor package | Jongho Park, Kyungsuk Oh, Hyunki Kim, Sangsoo Kim, Seungkon Mok +2 more | 2021-08-24 |
| 10978374 | Semiconductor package for discharging heat generated by semiconductor chip | Hyunki Kim, Sangsoo Kim, Seung Hwan Kim, Kyung Suk Oh, Jongho Lee | 2021-04-13 |