Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903177 | Method of manufacturing a semiconductor package | Se Jin Yoo, Hong-Sub Joo | 2021-01-26 |
| 10886253 | Semiconductor package | Saet Byeol Lee, You Kyung Son, Seung Lo Lee, Ho Soo Han | 2021-01-05 |
WH
Won-Gil Han
Overall (2021): #99,212 of 548,734Top 20%
2
Patents 2021