Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943939 | Via structures including etch-delay structures and semiconductor devices having via plugs | Byung-Jun Park, Chang-Rok Moon, Seung-Hun Shin, Seong-Ho Oh, June-Taeg Lee | 2021-03-09 |
TO
Tae-Seok Oh
Overall (2021): #240,543 of 548,734Top 45%
1
Patents 2021