Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11140772 | Printed circuit board including warpage offset regions and semiconductor packages including the same | Youngbae Kim | 2021-10-05 |
| 11024568 | Semiconductor package | Young Bae Kim | 2021-06-01 |