Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037890 | Semiconductor assembly with package on package structure and electronic device including the same | Ki Cheol BAE, Chui Woo Park, Kwang Sub Lee, Se Young Jang, Chi-Hyun Cho | 2021-06-15 |