Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205614 | Stack packages | Seungki Nam, Jiyoung Park, Bo-Yu Pu | 2021-12-21 |
| 11080460 | Method of modeling high speed channel in semiconductor package, method of designing semiconductor package using the same and method of manufacturing semiconductor package using the same | Bo-Yu Pu | 2021-08-03 |