Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158581 | Semiconductor package having semiconductor chip between first and second redistribution layers | Doohwan Lee | 2021-10-26 |
| 11127646 | Fan-out semiconductor package | Doohwan Lee, Jinseon Park | 2021-09-21 |