Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114461 | Three-dimensional semiconductor memory devices having source structure overlaps buried insulating layer | Jaeryong Sim, Giyong Chung, Jeehoon Han | 2021-09-07 |
JA
Jongseon Ahn
Overall (2021): #402,646 of 548,734Top 75%
1
Patents 2021