Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114461 | Three-dimensional semiconductor memory devices having source structure overlaps buried insulating layer | Jaeryong Sim, Giyong Chung, Jeehoon Han | 2021-09-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114461 | Three-dimensional semiconductor memory devices having source structure overlaps buried insulating layer | Jaeryong Sim, Giyong Chung, Jeehoon Han | 2021-09-07 |