Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011473 | Semiconductor package | Younhee Kang, Byoung-Gug Min, Shi-kyung Kim, Min-Woo Song | 2021-05-18 |
| 10971376 | Printed circuit board with protective member and method of manufacturing semiconductor package having the same | Hyeong Gi Lee | 2021-04-06 |