Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031307 | Semiconductor package, buffer wafer for semiconductor package, and method of manufacturing semiconductor package | Chan-hee Jeong, Joo-Hyung Lee, Jae Gil Lim | 2021-06-08 |