HK

Heebok Kang

Samsung: 1 patents #7,111 of 16,990Top 45%
Overall (2021): #436,879 of 548,734Top 80%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10964560 Substrate chuck and substrate bonding system including the same Youngbin Choi 2021-03-30