Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088081 | Semiconductor package having a connection structure with tapering connection via layers | — | 2021-08-10 |
HJ
Han Na Jin
Overall (2021): #440,541 of 548,734Top 85%
1
Patents 2021