Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177199 | Semiconductor packages with external bump pads having trench portions and semiconductor modules including the semiconductor packages | — | 2021-11-16 |
| 11003266 | Display device | Sunghwan Kim, Gwangbum Ko, Doik Kim, Junghak Kim, Yeonsung Jung | 2021-05-11 |