Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107681 | Method of fabricating semiconductor device by removing material on back side of substrate | Ji Youn Seo, Ji Woon Im, Ik Soo Kim, Sang-Ho Rha | 2021-08-31 |
| 10950544 | Semiconductor device including gate pattern having pad region | Dong-Ik LEE, Ji Woon Im, Se-mee Jang, Bo Ra Nam | 2021-03-16 |