Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10959338 | Attaching an SMD to an insulating layer with a solder joint in a cavity formed in an insulating layer | Philippe Chocteau, Jacky Jouan | 2021-03-23 |
| 10952314 | Removal of high stress zones in electronic assemblies | Philippe Chocteau | 2021-03-16 |