Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152339 | Method for improved transfer of semiconductor die | Andrew Huska, Cody Peterson, Sean Kupcow | 2021-10-19 |
| 11069551 | Method of dampening a force applied to an electrically-actuatable element | Justin Wendt, Cody Peterson, Sean Kupcow, Andrew Huska | 2021-07-20 |
| 10910354 | Apparatus for direct transfer of semiconductor device die | Cody Peterson, Sean Kupcow, Andrew Huska | 2021-02-02 |