Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11027549 | Bonding structure, head module, head device, and liquid discharge apparatus | — | 2021-06-08 |
TK
Takashi Kinokuni
Overall (2021): #242,032 of 548,734Top 45%
1
Patents 2021