Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11032915 | Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor | Siping Bai, Zhijian Wang, Zhigang Yang, Jinqiang Zhang | 2021-06-08 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11032915 | Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor | Siping Bai, Zhijian Wang, Zhigang Yang, Jinqiang Zhang | 2021-06-08 |