Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049876 | Three-dimensional memory device containing through-memory-level contact via structures | Zhixin Cui | 2021-06-29 |
| 10971507 | Three-dimensional memory device containing through-memory-level contact via structures | — | 2021-04-06 |
| 10903230 | Three-dimensional memory device containing through-memory-level contact via structures and method of making the same | Zhixin Cui | 2021-01-26 |