Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177155 | Direct bond method providing thermal expansion matched devices | — | 2021-11-16 |
| 10971538 | PiN diode structure having surface charge suppression | Justin Gordon Adams Wehner, Christian Boemler | 2021-04-06 |