Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195793 | Metal filling in a dielectric layer under metal layer one (M1)and above an active device layer in semiconductor devices | Stanley Seungchul Song | 2021-12-07 |
| 11176991 | Compute-in-memory (CIM) employing low-power CIM circuits employing static random access memory (SRAM) bit cells, particularly for multiply-and-accumluate (MAC) operations | Khaja Ahmad Shaik, Dawuth Shadulkhan Pathan | 2021-11-16 |