Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10888958 | Hybrid high temperature lead-free solder preform | Hongwen Zhang, Jonathan Minter, Ning-Cheng Lee | 2021-01-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10888958 | Hybrid high temperature lead-free solder preform | Hongwen Zhang, Jonathan Minter, Ning-Cheng Lee | 2021-01-12 |