Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964860 | Method of packaging semiconductor illumination module | Hung-Wei Kuo, Ya-Chin Tu | 2021-03-30 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964860 | Method of packaging semiconductor illumination module | Hung-Wei Kuo, Ya-Chin Tu | 2021-03-30 |