Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164801 | Electrically testable integrated circuit packaging | Mark Moffat, Andrew Christie, Duncan Pilgrim | 2021-11-02 |
| 11164891 | Integrated circuits with components on both sides of a selected substrate and methods of fabrication | James S. Cable, Anthony Mark Miscione | 2021-11-02 |
| 11053028 | Satellite system | Thomas E. Schwartzentruber | 2021-07-06 |
| 11057031 | Reliability in start up sequence for D-mode power FET driver | Arezu Bagheri, Buddhika Abesingha | 2021-07-06 |
| 10971419 | Method and apparatus for reducing noise on integrated circuit using broken die seal | Bryan Lee Hash | 2021-04-06 |