Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11130674 | Integrated package structure for MEMS element and ASIC chip and method for manufacturing the same | Sheng-Lin Ma, Dan Gong | 2021-09-28 |
| 11075072 | Wafer scale ultrasonic sensing device and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Huan Liu, Hung-Ping Lee +1 more | 2021-07-27 |