Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121114 | Wire bonding tool including a wedge tool | Yosuke Miyazawa | 2021-09-14 |
| 11041645 | Radiation receiving sensor and air conditioner, electronic cooker, and transport device including the same | Koichi Kusukame, Nawatt Silawan, Shinichi Shikii, Aki Yoneda, Kazuki Funase +4 more | 2021-06-22 |
| 10886205 | Terminal structure and semiconductor module | — | 2021-01-05 |