Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11122683 | Bare die integration with printed components on flexible substrate without laser cut | Tse Nga Ng, Ping Mei, Gregory Whiting, Steven E. Ready, Janos Veres | 2021-09-14 |