SS

Shinya Seki

OU Osaka University: 1 patents #67 of 281Top 25%
📍 Suita, JP: #39 of 118 inventorsTop 35%
Overall (2021): #260,485 of 548,734Top 50%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11049840 Bonding device Katsuaki Suganuma, Shijo Nagao, Akio Shimoyama 2021-06-29