Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114483 | Cavityless chip-scale image-sensor package | Ying-Chih Kuo, Wei-Feng Lin, Chun-Sheng Fan | 2021-09-07 |
| 11056529 | Image-sensor chip-scale package and method for manufacture | Ying-Chih Kuo | 2021-07-06 |
| 11049894 | Solder mask dam design | — | 2021-06-29 |
| 10998285 | Code pattern for representing tracing number of chip | Ying-Chih Kuo | 2021-05-04 |
| 10985149 | Semiconductor device package and method of manufacturing the same | Ying-Chih Kuo, Wei-Feng Lin | 2021-04-20 |